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rev. 1.2 1/14 copyright ? 2014 by silicon laboratories si7005 si7005 d igital i 2 c h umidity and t emperature s ensor features applications description the si7005 is a digital relative humidity and temperature sensor. this monolithic cmos ic integrates temperature and humidity sensor elements, an analog-to-digital conver ter, signal processing, calibration data, and an i 2 c host interface. the patented use of industry-standard, low-k polymeric dielectrics for sensing humidity enables the construction of a low-power, monolithic cmos sensor ic with low drift and hysteresis and excellent long term stability. both the temperature and humidity sensors are factory-calibrated and the calibration data is stored in the on-chip non-volatile memory. this ensures that the sensors are fully interchangeable, with no recalibration or software changes required. the si7005 is packaged in a 4x4 mm qfn package and is reflow solderable. the optional factory-installed protective cover offers a low- profile, convenient means of protecti ng the sensor during assembly (e.g., reflow soldering) and throughout the life of the product, excluding liquids (hydrophobic/oleophobic) and particulates. the si7005 offers an accurate, low-power, factory-calibrated digital solution ideal for measuring temperature, humidity, and dew-point in applications ranging from hvac/r an d asset tracking to industrial and consumer platforms. ? relative humidity sensor ?? 4.5 % rh (maximum @ 0?80% rh) ? temperature sensor ?? 0.5 oc accuracy (typical) ?? 1 oc accuracy (maximum @ 0 to 70 c) ? 0 to 100% rh operating range ? ?40 to +85 c (gm) or 0 to +70 c operating range (fm) ? wide operating voltage range (2.1 to 3.6 v) ? low power consumption ?? 240 a during rh conversion ? i 2 c host interface ? integrated on-chip heater ? 4x4 mm qfn package ? excellent long term stability ? factory calibrated ? optional factory-installed cover ?? low-profile ?? protection during reflow ?? excludes liquids and particulates (hydrophobic/oleophobic) ? industrial hvac/r ? thermostats/humidistats ? respiratory therapy ? white goods ? micro-environments/data centers ? automotive climate control and de-fogging ? asset and goods tracking patent protected; patents pending ordering information see ordering guide. pin assignments 1 6 5 4 3 2 18 13 14 15 16 17 24 19 20 21 22 23 12 7 8 9 10 11 gnd dnc dnc sda scl dnc dnc dnc cs dnc dnc dnc dnc gnd c ext v dd gnd dnc gnd dnc dnc dnc dnc dnc
si7005 2 rev. 1.2 functional block diagram si7005 v dd c = 0.1 f c = 4.7 f v dd cext gnd scl sda cs humidity sensor temperature sensor mux adc nv cal 32 khz osc logic i 2 c serial if v dd r = 10 k (typ) r = 10 k (typ) i 2 c pullups may be integrated in microcontroller microcontroller pxx pxz pxy
si7005 rev. 1.2 3 t able of c ontents section page 1. electrical specificat ions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 2. typical application ci rcuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0 3. bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4. functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 4.1. overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 4.2. relative humidity sens or accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.3. linearization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 4.4. temperature compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.5. hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 4.6. prolonged exposure to high humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.7. pcb assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.8. protecting the sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.9. bake/hydrate procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.10. long term drift/agi ng . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5. host interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.1. i 2 c interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.2. i 2 c operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 6. si7005 connection diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7. control registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 7.1. register detail (defaults in bold) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 8. pin descriptions: si7005 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 9. ordering guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 10. package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 10.1. 24-pin qfn . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 10.2. 24-pin qfn with protective cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 11. pcb land pattern and solder mask d esign . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 12. top marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 12.1. si7005 top marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 12.2. top marking explana tion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 13. additional reference resour ces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 document change list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 contact information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
si7005 4 rev. 1.2 1. electrical specifications unless otherwise specified, all mi n/max specifications apply over the recommended operating conditions. table 1. recommended operating conditions parameter symbol test condition min typ max unit power supply v dd 2.1 3.3 3.6 v operating temperature t a g grade ?40 ? 85 c operating temperature t a f grade 0 ? 70 c table 2. general specifications 2.1 ? v dd ? 3.6 v; t a = 0 to 70 c (f grade) or ?40 to 85 c (g grade) unless otherwise noted. parameter symbol test condition min typ max unit input voltage high v ih cs , scl, sda pins 0.7xv dd ?? v input voltage low v il cs , scl, sda pins ? ? 0.3xv dd v input voltage range v in scl, sda pins with respect to gnd 0.0 ? 3.6 v cs , c ext pin with respect to gnd 0.0 ? v dd v input leakage i il cs , scl, sda pins ? ? 1 a output voltage low v ol sda pin; i ol = 8.5 ma; v dd = 3.3 v ??0.6v sda pin; i ol = 3.5 ma; v dd = 2.1 v ??0.4v notes: 1. si7005 can draw excess current if v dd and cs are ramped high together. to enter the lowest power mode, either hold cs low while v dd ramps or pulse cs low after v dd reaches its final value. 2. sda and scl pins have an internal 75 k ? pull-up resistor to vdd
si7005 rev. 1.2 5 power consumption i dd rh conversion in progress ? 240 560 a temperature conversion in progress ? 320 565 a average for 1 temperature and 1 rh conversion / minute ?1?a cs < v il ; no conversion in progress; v dd = 3.3 v; sda = scl v ih ? 150 ? a cs > v ih ??100a cs < v il ; no conversion in progress; v dd = 3.3 v; sda = scl v ih ; heat = 1 ?2431 ma conversion time t conv 14-bit temperature; 12-bit rh (fast = 0) 35 40 ms 13-bit temperature; 11-bit rh (fast = 1) 18 21 wake up time t cs from cs < vil to ready for a temp/rh conversion 10 15 ms power up time t pu from v dd 2.1v to ready for a temp/rh conversion 10 15 ms table 2. general specifications (continued) 2.1 d v dd d 3.6 v; t a = 0 to 70 c (f grade) or ?40 to 85 c (g grade) unless otherwise noted. parameter symbol test condition min typ max unit notes: 1. si7005 can draw excess current if v dd and cs are ramped high together. to enter the lowest power mode, either hold cs low while v dd ramps or pulse cs low after v dd reaches its final value. 2. sda and scl pins have an internal 75 k : pull-up resistor to vdd
si7005 6 rev. 1.2 figure 1. i 2 c interface timing diagram table 3. i 2 c interface specifications* 2.1 ? v dd ? 3.6 v; t a = 0 to 70 c (f grade) or ?40 to +85 c (g grade) unless otherwise noted. parameter symbol test condition min typ max unit hysteresis v hys high-to-low versus low-to- high transition 0.05 x v dd ??v sclk frequency f scl ? ? 400 khz scl high time t skh 0.6 ? ? s scl low time t skl 1.3 ? ? s start hold time t sth 0.6 ? ? s start setup time t sts 0.6 ? ? s stop setup time t sps 0.6 ? ? s bus free time t buf between stop and start 1.3 ? ? s sda setup time t ds 100 ? ? ns sda hold time t dh 100 ? ? ns sda valid time t vd;dat from scl low to data valid ? ? 0.9 s sda acknowledge valid time t vd;ack from scl low to data valid ? ? 0.9 s *note: all values are referenced to v il and/or v ih . scl d7 1/f scl t skh sda t skl t sth d6 d5 d0 r/w ack t ds t dh start bit stop bit t buf t sts t vd : ack t sps
si7005 rev. 1.2 7 figure 2. rh accuracy at 30 c table 4. humidity sensor 2.1 ? v dd ? 3.6 v; t a = 25 c; t conv = 35 ms unless otherwise noted. parameter symbol test condition min typ max unit operating range 1 non-condensing 0 ? 100 %rh resolution 2 ? ? 12 bit accuracy 3,4 20?80% rh ? 3.0 4.5 %rh 0?100% rh see figure 2 repeatability?noise ? 0.05 ? %rh rms response time 5 ? 63% 1 m/s airflow ? 18 ? s hysteresis ? 1 ? %rh long term stability 4 ? ? 0.25 ? %rh/yr notes: 1. recommended humidity operating range is 20 to 80% rh (non-condensing) over 0 to 60 c. prolonged operation beyond these ranges may result in a shift of sensor reading, with slow recovery time. 2. the si7005 has a nominal output of 16 codes per %rh, with 0h0000 = ?24%rh. 3. excludes hysteresis, long term drift, and certain other fact ors and is applicable to non-condensing environments only. see section ?4.2. relative humidity sensor accuracy? for more details. 4. may be impacted by dust, vaporized solvents or other contaminants, e.g., out-gassi ng tapes, adhesives, packaging materials, etc. see section ?4 .10. long term drift/aging?. 5. time for sensor output to reach 63% of its final value after a step change. 0 1 2 3 4 5 6 7 8 9 10 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 rh measurement error (%) relative humidity (%) rh accuracy max. rh error (%) typ. rh error (%)
si7005 8 rev. 1.2 figure 3. temperature accuracy table 5. temperature sensor 2.1 ? v dd ? 3.6 v; t a = 0 to 70 c (f grade) or ?40 to +85 c (g grade); t conv = 35 ms unless otherwise noted. parameter symbol test condition min typ max unit operating range ?40 ? 85 c resolution 1 ??14bit ? ? 1/32 c accuracy 2 typical at 25 c ? 0.5 1.0 c maximum see figure 3. c repeatability?noise ? 0.1 ? c rms response time 3 time to reach 63% of final value ? 1.5 ? s long term stability ? <0.05 ? c/yr notes: 1. the si7005 has a nominal output of 32 codes /c, with 0000 = ?50 c 2. temperature sensor accuracy is for v dd = 2.3 to 3.6 v. 3. actual response times will vary dependent on system thermal mass and air-flow. 0 0.5 1 1.5 2 2.5 3 3.5 4 r 40 r 35 r 30 r 25 r 20 r 15 r 10 r 5 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 125 temperature measurement error (c) temperature (c) temperature accuracy max. t error (c) typ. t error (c)
si7005 rev. 1.2 9 table 6. thermal characteristics parameter symbol test condition qfn-24 unit junction-to-air thermal resistance ? ja jedec 4-layer board 55 c/w junction-to-air thermal resistance ? ja 2-layer evaluation pcb with minimal thermal pad 110 c/w table 7. absolute maximum ratings 1,2 parameter symbol test condition min typ max unit ambient temperature under bias ?55 ? 125 c storage temperature ?65 ? 150 c voltage on sda or scl pin with respect to gnd ?0.3 ? 3.9 v voltage on cs pin with respect to gnd ?0.3 ? vdd + 0.3 v voltage on v dd with respect to gnd ?0.3 ? 4.2 v esd tolerance hbm ? ? 3 kv cdm ? ? 750 v mm ? ? 300 v notes: 1. absolute maximum ratings are stress ratings only; operation at or beyond these conditions is not implied and may shorten the life of the device or alter its performance. 2. for best accuracy, after removal from the sealed shi pping bags, the si7005 should be stored in climate controlled conditions (10 to 35 c, 20 to 60 %rh). exposure to high te mperature and/or high humidity environments can cause a small upwards shift in rh readings.
si7005 10 rev. 1.2 2. typical application circuits note: if the si7005 shares an i 2 c bus with other slave devices, it should be powered down when the master controller is com- municating with the other slave devices. the si7005 can be powered down either by setting the cs signal to logic high or setting the vdd pin to 0 v. refer to figure 5 for an illustration of this method of powering the si7005 from an mcu gpio (the si7005 vdd is powered from an mcu port pin). figure 4. typical application circuit figure 5. typical application circui t for battery-powered applications sda scl vdd csb gnd r2 10k r1 10k u1 si7005 dnc 13 dnc 14 sda 4 dnc 6 scl 3 dnc 5 dnc 2 gnd 1 cs 15 dnc 16 dnc 17 dnc 18 dnc 12 gnd 11 cext 10 gnd 8 vdd 9 gnd 19 dnc 24 dnc 20 dnc 23 dnc 22 dnc 21 dnc 7 epad 25 c2 0.1uf c1 4.7uf sda scl port pin gnd vdd r3 15.0 r1 10k u2 si7005 dnc 13 dnc 14 sda 4 dnc 6 scl 3 dnc 5 dnc 2 gnd 1 cs 15 dnc 16 dnc 17 dnc 18 dnc 12 gnd 11 cext 10 gnd 8 vdd 9 gnd 19 dnc 24 dnc 20 dnc 23 dnc 22 dnc 21 dnc 7 epad 25 c2 0.1uf r2 10k c1 4.7uf
si7005 rev. 1.2 11 3. bill of materials table 8. typical application circuit bom reference description mfr part number manufacturer c1 capacitor, 4.7 f, 6.3 v, x5r, 0603 c0603x5r6r3-475m venkel c2 capacitor, 0.1 f, 6.3 v, x7r, 0603 c0603x7r6r3-104m venkel r1 * resistor, 10 k ? , 5%, 1/16w, 0603 cr0603-16w-1002j venkel r2 * resistor, 10 k ? , 5%, 1/16w, 0603 cr0603-16w-1002j venkel u1 ic, digital temperature/humi dity sensor si7005 silicon labs *note: typical value shown. optimal value depends on bus capaci tance and speed of bus operati on; not needed if present elsewhere in the system. table 9. typical application circuit for battery-powered applications bom reference description mfr part number manufacturer c1 capacitor, 4.7 f, 6.3 v, x5r, 0805 c0805x5r160-475m venkel c2 capacitor, 0.1 f, 6.3 v, x7r, 0603 c0603x7r6r3-104m venkel r1 * resistor, 10 k ? , 5%, 1/16w, 0603 cr0603-16w-1002j venkel r2 * resistor, 10 k ? , 5%, 1/16w, 0603 cr0603-16w-1002j venkel r3 resistor, 15 ? , 5%, 1/16w, 0603 cr0603-16w-15r0j venkel u1 ic, digital temperature/humi dity sensor si7005 silicon labs *note: typical value shown. optimal value depends on bus capaci tance and speed of bus operati on; not needed if present elsewhere in the system.
si7005 12 rev. 1.2 4. functional description figure 6. si7005 functional block diagram 4.1. overview the si7005 is a digital relative humidity and temperature sensor. this monolithic cmos ic integrates temperature and humidity sensor elements, an analog-to-digital c onverter, signal processing, calibration data, and an i 2 c host interface. both the temperature and hum idity sensors on each unit are factory-calibrated and the calibration data is stored in the on-chip non-volatile memory. this ensures that the sensors are fully interchangeable, with no recalibration or software changes required. while the si7005 is largely a conventional mixed-signal cmos integrated circuit, relative humidity sensors in general and those based on capacitive sensing using polymeric dielectric have unique application and use requirements that are not common to conventional (non-sensor) ics. chief among those are: ?? the need to protect the sensor during board assembly, i.e., solder reflow, and the need to subsequently rehydrate the sensor. ?? the need to protect the sensor from damage or contamination during the product life-cycle ?? the impact of prolonged exposure to extremes of temper ature and/or humidity and their potential affect on sensor accuracy ?? the effects of humidity sensor ?memory? ?? the need to apply temperature correction and linearization to the humidity readings each of these items is discussed in more detail in the following sections. si7005 v dd c = 0.1 f c = 4.7 f v dd cext gnd scl sda cs humidity sensor temperature sensor mux adc nv cal 32 khz osc logic i 2 c serial if v dd r = 10 k (typ) r = 10 k (typ) i 2 c pullups may be integrated in microcontroller microcontroller pxx pxz pxy
si7005 rev. 1.2 13 4.2. relative humidi ty sensor accuracy to determine the accuracy of a relative humidity sensor, it is placed in a temperat ure and humidity controlled chamber. the temperature is set to a convenient fixed va lue (typically 30 c) and the relative humidity is swept from 20 to 80% and back to 20% in the following steps: 20% ? 40% ? 60% ? 80% ? 80% ? 60% ? 40% ? 20%. at each set-point, the cham ber is allowed to settle for a period of 30 minutes before a reading is taken from the sensor. prior to the sweep, the device is allowed to st abilize to 50%rh. the solid top and bottom trace in figure 7, ?measuring sensor accuracy including hysteresis,? shows the result of a typical sweep after non-linearity compensation. figure 7. measuring sensor accuracy including hysteresis r 5 r 4 r 3 r 2 r 1 0 1 2 3 4 5 10 20 30 40 50 60 70 80 90 %rh accuracy %rh setrpoint rh accuracy vs. rh set r point hysteresis
si7005 14 rev. 1.2 the rh accuracy is defined as the center (dashed) line shown in figure 7, which is the average of the two data points at each relative humidity set-point. in this case, the sensor shows an accuracy of 0.25%rh. the si7005 accuracy specification (table 4) includes: ?? unit-to-unit and lot-to-lot vari ation in non-linearity compensation ?? accuracy of factory calibration ?? margin for shifts that can occur during solder reflow (compensation for shift due to reflow is included in the linearization procedure below). the accuracy specification does not include: ?? hysteresis (typically 1%) ?? effects from long term exposure to very humid conditions ?? contamination of the sensor by particulates, chemicals, etc. ?? other aging related shifts (?long-term stability?) ?? variations due to temperature (a temperatur e compensation method is described in section ?4.4. temperature compens ation?). after application of temperature compensation, rh readings will typically vary by less than 0.05%/c.
si7005 rev. 1.2 15 4.3. linearization capacitive relative humidity sensors r equire linearization. the si7005 accuracy specification (table 4) applies after correction of non-linearity errors. the recommended lineari zation technique is to correct the measured relative humidity value with a 2nd order polynomial; the linear rela tive humidity (rh) value is calculated as follows: where: ?? rh linear is the corrected relative humidity value in %rh ?? rh value is the uncorrected (measured) relative humidity value in %rh ?? a 2 , a 1 , and a 0 are unit-less correction coefficients derived through characteri zation of si7005s by silicon laboratories; their values depend on whether compensation for a typical solder reflow is required the values for the correction coefficients are shown in table 10. table 10. linearization coefficients coefficient value a 0 ?4.7844 a 1 0.4008 a 2 ?0.00393 rh linear rh value rh value 2 a 2 rh value a 1 a 0 + u + u ? =
si7005 16 rev. 1.2 4.4. temperature compensation the si7005 relative humidity sensor is calibrated at a temperature of 30 c; it is at this temperat ure that the sensor will give the most accurate relative hu midity readings. for rela tive humidity measurement s at other temperatures, the rh reading from the si7005 must be compensated for the change in temperature relative to 30 c. temperature compensated relative humidity readings can be calculated as follows: where: ?? rh tempcompensated is the temperature compensated relative humidity value in %rh. ?? rh linear is the linear corrected rela tive humidity value in %rh. ?? temperature is the ambient temperature in c as measured by the si7005 on chip temperature sensor. ?? q 1 and q 0 are unit-less correction coefficients derived th rough characterization of si7005s by silicon laboratories. this temperature compensation is most accurate in the range of 15?50 c. the values for the correction coefficients are shown in table 11. 4.5. hysteresis the moisture absorbent film (polymeric dielectric) of the humidity sensor will carry a memory of its exposure history, particularly its recent or extreme exposure history. a sensor exposed to relative ly low humidity will carry a negative offset relative to the fact ory calibration, and a sensor exposed to relatively high humidity will carry a positive offset relative to the factory calibration. this fa ctor causes a hysteresis effe ct illustrated by the solid top and bottom traces in figure 7. the hysteresis value is the difference in %rh between the maximum absolute error on the decreasing humidity ramp and the maximum absolu te error on the increasing humidity ramp at a single relative humidity setpoint and is expre ssed as a bipolar quantity relative to the average, the center dashed trace in figure 7. in the case of figure 7, the measurement un certainty due to the hysteresis effect is 1.05%rh. 4.6. prolonged expos ure to high humidity prolonged exposure to high humidity will result in a gra dual upward drift of the rh reading. the shift in sensor reading resultin g from this drift will generally disappear slowly unde r normal ambient cond itions. the amount of shift is proportional to the magnitude of relative humidi ty and the length of exposure. in the case of lengthy exposure to high humidity, some of the resulting shift may persist indefinitely under typical conditions. it is generally possible to substantially re verse this affect by baking the device (see section ?4.9. bake/hydrate procedure?). table 11. linearization coefficients coefficient value q 0 0.1973 q 1 0.00237 rh tempcompensated rh linear temperature 30 ? rh linear q 1 q 0 + u u + =
si7005 rev. 1.2 17 4.7. pcb assembly 4.7.1. soldering like most ics, si7005 devices are shipped from the fa ctory vacuum-packed with an enclosed desiccant to avoid any drift during storage and to prevent any moisture-r elated issues during solder reflow. devices should be soldered using reflow and a ?no clean? solder process, as a water or solvent rinse after soldering may affect accuracy. see "11. pcb land pattern and solder mask design" on page 34 for the recommended card reflow profile. it is essential that the exposed polymer sensing film be kept clean and undamaged. it is recommended that a protective cover of some kind be in place during pcb assembly. kapton ? * polyimide tape is recommended as a protective cover. see table 12 below for examples of tape products that may be used for protection during the soldering operation. alternatively, si7005s may be ordered with a factory-fitted, so lder-resistant protective cove r that can be left in place for the lifetime of the product, preventing liquids, dust, or other contaminants from coming into contact with the polymer sensor film. see "9. ordering guide" on page 31 for a list of ordering part numbers that include the cover. 4.7.2. rehydration the measured humidity value w ill generally shift slightly after solder refl ow. a portion of this shift is permanent and is accounted for when using the linearization procedure give n above. after soldering, an si7005 should be allowed to equilibrate under controlled rh cond itions (room temperature, 45?55%rh) fo r at least 48 hours to eliminate the remainder of the shift and return the devi ce to its specified accuracy performance. 4.7.3. rework to maintain the specified sensor performance, care must be taken during rework to minimize the exposure of the device to excessive heat and to avoid damage/contaminati on or a shift in the sensor reading due to liquids, solder flux, etc. manual touch-up using a soldering ir on is permissible under the following guidelines: ?? the exposed polymer sensing film must be kept clean and undamaged. a protective cover is recommended during any rework operation (kapton ? tape or the factory-installed cover). ?? flux must not be allowed to contaminate the sensor; liquid flux is not recommended even with a cover in place. conventional lead-free solder with rosin core is acceptable for touch-up as long as a cover is in place during the rework. ?? avoid water or solvent rinses after touch-up. ?? minimize the heating of th e device. it is recommended that soldering iron temper atures not exceed 350 c and that the contact time per pin does not exceed five seconds. hot air rework is not recommended. if a device must be re placed, remove the device by hot air and solder a new part in its place by reflow following the guidelines above. *note: all trademarks are the property of their respective owners. figure 8. si7005 with factory-installed protective cover table 12. tape products for protection during soldering manufacturer part number* manufacturer kppd-1/8 kaptontape.com *note: provided for information only.
si7005 18 rev. 1.2 4.8. protecting the sensor because the sensor operates on the pr incipal of measuring a change in capacitance, any changes to the dielectric constant of the polymer film will be detect ed as a change in relative humidity. therefore, it is important to minimize the probability of contaminants coming into contact with the sensor. dust and ot her particles as well as liquids can affect the rh reading. it is recommended that a filter cove r is employed in the end system that blocks contaminants but allows water vapor to pass through. depending on the needs of the application, this can be as simple as plastic or metallic gauze for basic protection against particulates or something more sophisticated such as a hydrophobic membrane providing up to ip67 compliant protection. si7005s may be ordered with a factory fitt ed, solder-resistant cover, which can be left in place for the lifetime of the product. it is very low-profile, hydrophobic and oleophobic , and excludes particulates down to 0.35 microns in size. see section ?9. ordering guide? for a list of ordering pa rt numbers that include the cover. a dimensioned drawing of the ic with the cover is included in section ?10. package outline?. other characteristi cs of the cover are listed in table 13. the sensor should be protected from direct sunlight to prevent heating effects as well as possible material degradation. 4.9. bake/hydrate procedure after exposure to extremes of temperature and/or humi dity for prolonged periods, the polymer sensor film can become either very dry or very wet, in each case the result is either high or low relative humidity readings. under normal operating conditions, the induced error will diminish over time. from a very dry condition, such as after shipment and soldering, the error will diminish over a few days at ty pical controlled ambient conditions, e.g., 48 hours of 45 %rh 55. however, from a very wet condition, recovery may take signi ficantly longer. to accelerate recovery from a wet condition, a bak e and hydrate cycle can be implemente d. this operation consists of the following steps: ? baking the sensor at 125 c for 12 hours ? hydration at 30 c in 75 %rh for 10 hours following this cycle, the sensor will return to normal operation in typical ambient conditions after a few days. 4.10. long term drift/aging over long periods of time, the sensor readings may dr ift due to aging of the devic e. standard accelerated life testing of the si7005 has resulted in the specifications for long-term drift shown in table 4 and table 5. this contribution to the overall sensor accuracy accounts only for the long-term aging of the device in an otherwise benign operating environment and does not include the affe cts of damage, contamination, or exposure to extreme environmental conditions. table 13. specifications of protective cover parameter value material eptfe water entry pressure 2.7 bar pore size 0.35 operating temperature ?40 to +125 c maximum reflow temperature 260 c oleophobicity (aatcc 118 ? 1992) 7 ip rating (per iec 529) ip67
si7005 rev. 1.2 19 5. host interface 5.1. i 2 c interface the si7005 has an i 2 c serial interface with a 7-bit address of 0x40. the si7005 is a slave device supporting data transfer rates up to 400 khz. table 24 sh ows the register summary of the si7005. 5.1.1. performing a relative humidity measurement the following steps should be performed in sequence to take a relative humidity measurement: 1. set start (d0) in config to begin a new conversion 2. poll rdy (d0) in status (register 0) until it is low (= 0) 3. read the upper and lower bytes of the rh value from datah and datal (registers 0x01 and 0x02), respectively. table 14 shows the format of the 12-bit relative humidity result. 4. convert the rh value to %rh using the following equation: where rh is the measured valu e returned in datah:datai 5. apply temperature compensation and/or lineariza tion as discussed elsewhere in this data sheet table 15 shows the 12-bit values that correspond to various measured rh levels. the above sequence assumes normal mode, i.e., t conv = 35 ms (typical). conversi ons may be performed in fast mode. see section ?5.1.3. fast conversion mode?. table 14. 12-bit relative humidity result available in registers 1 and 2 datah datai d7 d6 d5 d4 d3 d2 d1 d0 d7 d6 d5 d4 d3 d2 d1 d0 12-bit relative humidity code 0 0 0 0 table 15. typical %rh measurement codes for 0 to 100% rh range %rh 12 bit code dec hex 0 384 180 10 544 220 20 704 2c0 30 864 360 40 1024 400 50 1184 4a0 60 1344 540 70 1504 5e0 80 1664 680 90 1824 720 100 1984 7c0 %rh rh 16 -------- - ?? ?? 24 ?=
si7005 20 rev. 1.2 5.1.2. performing a temperature measurement the following steps should be performed in sequence to take a temperature measurement: 6. set start (d0) and temp (d4) in config (register 0x 03) to begin a new conversion, i.e., write config with 0x11 7. poll rdy (d0) in status (reg ister 0) until it is low (=0) 8. read the upper and lower bytes of the temperature value from datah and datal (registers 0x01 and 0x02), respectively table 16 shows the format of the 14-bit temperature result . this value may be converte d to c using the following equation: where temp is the measured value returned in datah:datai. table 17 shows the 14-bit values that correspond to various measured temperature levels. the above sequence assumes normal mode, i.e., t conv = 35 ms (typical). conversi ons may be performed in fast mode. see section ?5.1.3. fast conversion mode?. table 16. 14-bit temperature result available in registers 1 and 2 datah datai d7 d6 d5 d4 d3 d2 d1 d0 d7 d6 d5 d4 d3 d2 d1 d0 14-bit temperature code 0 0 temperature ? c ?? temp 32 ----------------- ?? ?? 50 ? =
si7005 rev. 1.2 21 table 17. typical temperature measurement codes for the ?40 c to 100 c range temp(c) 14 bit code dec hex ?40 320 0140 ?30 640 0280 ?20 960 03c0 ?10 1280 0500 0 1600 0640 10 1920 0780 20 2240 08c0 30 2560 0a00 40 2880 0b40 50 3200 0c80 60 3520 0dc0 70 3840 0f00 80 4160 1040 90 4480 1180 100 4800 12c0
si7005 22 rev. 1.2 5.1.3. fast conversion mode the time needed to perform a temperature or rh me asurement can be reduced from 35 ms (typical) to 18 ms (typical) by setting fast (d5) in config (register 0x03). fast mode reduces the total power consumed during a conversion or the average power cons umed by the si7005 when making period ic conversions. it also reduces the resolution of the measurements. table 18 is a comparison of the normal and fast modes. 5.1.4. heater the si7005 relative humidity sensor contains an integrated , resistive heating element that may be used to raise the temperature of the humidity sensor. this element can be used to drive off condensation or to implement dew-point measurement when the si7005 is used in conjunction with a separate temperature sensor such as another si7005. the heater can be activated by setting heat (d1) in config (register 0x03). tu rning on the heater will reduce the tendency of the humidity sensor to accumulate an offset due to ?memory? of sustained high humidity conditions. when the heater is enabled, the reading of the on-chip temperature sensor will be affected (increased). 5.1.5. device identification the si7005 device and its revision level can be determined by reading id (register 0x11). table 19 lists the values for the various device revisions and may include revisions not yet in existence. table 18. normal vs. fast mode parameter value normal mode fast mode t conv (typical) 35ms 18ms temperature resolution 14-bit 13-bit rh resolution 12-bit 11-bit table 19. device id revision values device id value device type revision level d[7:4] d[3:0] 0101 0000 si7005 b
si7005 rev. 1.2 23 5.2. i 2 c operation the si7005 uses a digital i 2 c interface. if the si7005 shares an i 2 c bus with other slave devices, it should be powered down when the master controller is communica ting with the other slave devices. the si7005 can be powered down either by setting the cs signal to logic high or setting the vdd pin to 0 v. a method of achieving this by powering the si7005 from an mcu gpio is shown in figure 5. the format of the address byte is shown in table 20. 5.2.1. i 2 c write operation to write to a register on the si7005, the master should issue a start command (s) followed by the slave address, 0x40. the slave address is followed by a 0 to indicate th at the operation is a write. upon recognizing its slave address, the si7005 issues an acknowledge (a) by pulling the sda line lo w for the high duratio n of the ninth scl cycle. the next byte the master places on the bus is the register address poi nter, selecting the register on the si7005 to which the data should be transferred. after th e si7005 acknowledges this byte, the master places a data byte on the bus. this byte will be written to the regi ster selected by the addr ess pointer. the si7005 will acknowledge the data byte, after which the master issues a stop command (p). see table 21. table 20. i 2 c slave address byte a6 a5 a4 a3 a2 a1 a0 r/w 10000001 / 0 master slave table 21. i 2 c write sequence sequence to write to a register s slave address w a address pointer aregister data ap sequence to start a relative humidity conversion s0x40 0 a 0x03 a 0x01 ap sequence to start a temperature conversion s0x40 0 a 0x03 a 0x11 ap
si7005 24 rev. 1.2 5.2.2. i 2 c read operation to read a register on the si7005, the master must first se t the address pointer to indicate the register from which the data is to be transferred. theref ore, the first communication with the si 7005 is a write operation. the master should issue a start command (s) followed by the slave address, 0x40. the slave address is followed by a 0 to indicate that the operation is a writ e. upon recognizing its slave address, the si7005 will issue an acknowledge (a) by pulling the sda line low for the high du ration of the ninth scl cycle. the next byte the master places on the bus is the register address pointer selecting the register on th e si7005 from which the data should be transferred. after the si7005 acknowledges this byte, th e master issues a repeated start command (sr) indicating that a new transfer is to take place. the si7005 is addre ssed once again with the r/w bit set to 1, indicating a read operation. the si7005 will acknowledge its slave address and output data fr om the previously-selected re gister onto the data bus under the control of the scl signal, the master should not acknowledge (a ) the data byte and issue a stop (p) command (see table 22). however, if a rh or temperature co nversion result (two bytes) is to be read, the master should acknowledge (a) the first data byte and continue to activa te the scl signal. th e si7005 will automatically output the second data byte. upon receiving the second byte, the master should issue a not acknowledge (a ) followed by a stop command. (see table 23). table 22. i 2 c read sequence for a single register sequence to read from a single register s slave address w a address pointer asr slave address r a register data a p sequence to read device id s0x40 0 a 0x11 asr 0x40 1 a id a p sequence to read rdy bit s0x40 0 a 0x 00 asr 0x40 1 a ? rdy a p table 23. i 2 c read sequence for rh or temperature conversion result sequence to read conversion result sslave address w aaddress pointer asr slave address r a register 1 data a register 2 data a p s0x40 0 a0x01 asr 0x40 1 a data h a data l a p
si7005 rev. 1.2 25 6. si7005 connection diagrams the si7005 is a simple-to-use device requiring a minimum of external co mponents. figure 9 shows the typical connection diagram for the si7005 connected to an mcu. (r efer to section ?8. pin descriptions: si7005? for full pin descriptions). the values for the two i 2 c pull-up resistors depend on the capacitance of the i 2 c bus lines and the desired speed of operation. refer to the i 2 c specification for further details. in this diagram cs is shown controlled by the mcu, allowing the si7005 to be placed in standby mode when not in use. a detailed schematic and bill-of- materials for this circuit can be found in section ?2. typical app lication circuits? and secti on ?3. bill of materials?. figure 9. typical connection diagram for ultra-low-power operation, such as in battery-powe red applications, connection as shown in figure 10 is recommended. in this case, the si7005 is powered from one of the mcu?s gpios. the gpio can be driven high to powerup the si7005, once the measurement results are obt ained, the gpio can be driven low to power-down the si7005, reducing its current consumption to zero. the gpio must be capable of sourcing 320 a for the duration of the conversion time (<200 ms for relative humidity and te mperature conversions) and up to 40 ma for a period of 5 ms at power-up. the gpio must also be capable of sinki ng up to 40 ma for a period of 5 ms at powerdown. if the gpio is not capable of sourcing/sinking 40 ma, then th e si7005 will take longer to powerup and po werdown. the purpose of the 15 ? resistor is to isolate the si7005 from potenti al high-frequency switching noise present on the mcu gpio. a detailed schematic and bill-of -materials for this circuit can be fo und in section ?2. typical application circuits? and section ?3. bill of materials?. 0.1 f 4.7f c ext gnd v dd scl sda cs si7005 scl sda px.x mcu gnd v dd c8051fxxx 2.1 to 3.6 v
si7005 26 rev. 1.2 figure 10. recommended connection diagram for low-power battery operation 15 ohm 0.1 f 4.7f c ext gnd v dd scl sda cs si7005 scl sda mcu gnd v dd c8051fxxx 2.1 to 3.6 v px.x
si7005 rev. 1.2 27 7. control registers table 24 contains a summary of the si7005 register set. each register is described in more detail below. 7.1. register detail (defaults in bold) reset settings = 0000_0001 table 24. si7005 register summary register name bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 i 2 c register summary 0 status rsvd rsvd rsvd rsvd rsvd rsvd rsvd /rdy 1 datah relative humidity or temperature, high byte 2 datal relative humidity or temperature, low byte 3 config rsvd rsvd fast temp rsvd rsvd heat start 17 id id3 id2 id1 id0 0 0 0 0 notes: 1. any register address not listed here is reserved and must not be written. 2. reserved register bits (rsvd) must always be written as zero; the result of a read operation on these bits is undefined. register 0. status bitd7d6d5d4d3d2d1d0 name /rdy type r bit name function 7:1 reserved reserved. reads undefined. 0 /rdy ready . 0 = conversion complete; resu lts available in datah:datal. 1 = conversion in progress.
si7005 28 rev. 1.2 reset settings = 0000_0000 reset settings = 0000_0000 register 1. datah bitd7d6d5d4d3d2d1d0 name relative humidity or temperature, high byte type r bit name function 7:0 datah data, high byte. eight most significant bits of a temperatur e or humidity measurement. see table 14 or table 16 for the measurement format. register 2. datai bitd7d6d5d4d3d2d1d0 name relative humidity or temperature, low byte type read bit name function 7:0 datal data, low byte. eight least significant bits of a temperatur e or humidity measurement. see table 14 or table 16 for the measurement format.
si7005 rev. 1.2 29 reset settings = 0000_0000 reset settings = 0101_0000 register 3. config bitd7d6d5d4d3d2d1d0 name fast temp heat start type r/w r/w r/w bit name function 7:6 reserved reserved. reads undefined. always write as zero. 5 fast fast mode enable . 0 = 35ms (typical) 1 = 18ms (typical) 4temp temperature enable . 0 = relative humidity 1 = temperature 3:2 reserved reserved. reads undefined. always write as zero. 1heat heater enable . 0 = heater off 1 = heater on 0start conversion start . 0 = do not start a conversion 1 = start a conversion register 17. id bitd7d6d5d4d3d2d1d0 name id7id6id5id4id3id2id1id0 type rrrrrrrr bit name function 7:0 id identification . see section ?5.1.5. device identification?.
si7005 30 rev. 1.2 8. pin descriptions: si7005 table 25. pin descriptions pin # pin name pin type* description 1, 8, 11, 19 gnd g ground. 2, 5?7, 12?14, 16?18, 20?24 dnc do not connect. do not connect any of these pins to supply, ground or any other signal. internal pull-ups or pull-do wns will prevent any of these pins from floating. 3s c li i 2 c clock signal. this pin is voltage-tolerant. see table 2. 4sdai/o i 2 c data signal. this pin is voltage-tolerant. see table 2. 9v dd s v dd power supply (2.1 v < v dd < 3.6 v). 10 c ext i decoupling input for internal circuitry. connect a 4.7 f capacitor between this pin and gnd. 15 cs i chip select?active low signal. epad t gnd g thermal paddle. this pad is connected to gnd internally. the pad can be con- nected to gnd externally or it can be left open-circuit and used as a thermal input to the on-chip temperature sensor. *note: g = ground, s = power supply, i = digital in put, o = digital output , i/o = input/output. 1 6 5 4 3 2 18 13 14 15 16 17 24 19 20 21 22 23 12 7 8 9 10 11 gnd dnc dnc sda scl dnc dnc dnc cs dnc dnc dnc dnc gnd c ext v dd gnd dnc gnd dnc dnc dnc dnc dnc
si7005 rev. 1.2 31 9. ordering guide table 26. si7005 device ordering guide p/n description typ. accuracy pkg operating range (c) filter cover packing format temp rh SI7005-B-FM1 digital temperature/humidity sensor 0.5 c 3% qfn-24 0 to 70 c y cut tape si7005-b-gm1 digital temperature/humidity sensor 0.5 c 3% qfn-24 ?40 to +85 c y cut tape SI7005-B-FMr digital temperature/humidity sensor 0.5 c 3% qfn-24 0 to 70 c n tape-and-reel SI7005-B-FM1r digital temperature/humidity sensor 0.5 c 3% qfn-24 0 to 70 c y tape-and-reel si7005-b-gmr digital temperature/humidity sensor 0.5 c 3% qfn-24 ?40 to +85 c n tape-and-reel si7005-b-gm1r digital temperature/humidity sensor 0.5 c 3% qfn-24 ?40 to +85 c y tape-and-reel SI7005-B-FM digital temperature/humidity sensor 0.5 c 3% qfn-24 0 to 70 c n tube si7005-b-gm digital temperature/humidity sensor 0.5 c 3% qfn-24 ?40 to +85 c n tube si7005usb- dongle usb demonstration/evaluation board si7005-evb si7005 daughter card with flex cable si7005evb-udp si7005 udp plug-in daughter card si7005evb- udp-f960 low-power data logger demo/devel- opment kit with c8051f960 mcu
si7005 32 rev. 1.2 10. package outline 10.1. 24-pin qfn figure 11 illustrates the package details for the si7005. tabl es 27 and 28 list the values for the dimensions shown in the illustration. there are two pa ckage variants with slightly differ ent height dimensions. the two package variants are otherwise interchangeable. figure 11. 24-pin quad flat no lead (qfn) note: all dimensions are in mm unless otherwise noted. table 27. 24-pin package diagram dimensions dimension min nom max dimension min nom max a1 0.00 0.02 0.05 h1 1.03 1.08 1.13 b 0.18 0.25 0.30 h2 1.68 ref d 4.00 bsc. l 0.30 0.35 0.40 d2 2.55 2.65 2.75 aaa ? ? 0.15 e 0.50 bsc. bbb ? ? 0.15 e 4.00 bsc. ccc ? ? 0.08 e2 2.55 2.65 2.75 ddd ?? 0.10 notes: 1. dimensioning and tolerancing per ansi y14.5m-1994. 2. recommended card reflow profile is per the jedec/ipc j-std-020 specification for small body components. table 28. package variants variant a variant b dimension min nom max min nom max a 0 . 8 00 . 9 01 . 0 00 . 7 00 . 7 50 . 8 0 ?
si7005 rev. 1.2 33 10.2. 24-pin qfn with protective cover figure 12 illustrates the package details for the si7005 with the opt ional protective cover. tables 29 and 30 list the values for the dimensions sh own in the illustration. there are two packa ge variants with slightly different height dimensions. the two package variants are otherwise interchangeable. figure 12. 24-pin quad flat no lead (qfn) with protective cover note: all dimensions are in mm unless otherwise noted. table 29. 24-pin package diagram dimensions dimension min nom max dimension min nom max a1 0.00 0.02 0.05 h 0.76 0.83 0.90 b 0.18 025 0.30 l 0.30 0.35 0.40 d 4.00 bsc. r1 0.45 0.50 0.55 d2 2.55 2.65 2.75 aaa ? ? 0.15 e 0.50 bsc. bbb ? ? 0.15 e 4.00 bsc. ccc ? ? 0.08 e2 2.55 2.65 2.75 ddd ? ? 0.10 f1 3.70 3.80 3.90 f2 3.70 3.80 3.90 notes: 1. dimensioning and tolerancing per ansi y14.5m-1994. 2. recommended card reflow profile is per the jedec/ipc j-std-020 specification for small body components. table 30. package variants variant a variant b dimension min nom max min nom max a ? ?1 . 4 1? ?1 . 2 1 a2 0.80 0.90 1.00 0.70 0.75 0.80 ?
si7005 34 rev. 1.2 11. pcb land pattern and solder mask design figure 13 illustrates the recommended pcb land pattern for use with the si7005's 4x4 mm qfn package. figure 13. typical qfn-24 pcb land pattern
si7005 rev. 1.2 35 table 31. pcb land pattern dimensions symbol mm c1 4.00 c2 4.00 e0 . 5 0 p1 2.75 p2 2.75 x1 0.30 y1 0.75 notes: general 1. all dimensions shown are at maximu m material condition (mmc). least material condition (lmc) is calculated based on a fabrication allowance of 0.05 mm. 2. this land pattern design is based on the ipc-7351 guidelines. solder mask design 3. all metal pads are to be non-solder mask defined (nsmd). clearance between the solder mask and the metal pad is to be 60 ? m minimum, all the way around the pad. stencil design 4. a stainless steel, laser-cut and electr o-polished stencil with trapezoidal walls should be used to assure good solder paste release. 5. the stencil thickness should be 0.125 mm (5 mils). 6. the ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins. 7. a 2x2 array of 0.95 mm square openings on 1.35 mm pitch should be used for the center ground pad. card assembly 8. a no-clean, type-3 solder paste is recommended. 9. the recommended card reflow profile is per the jedec/ipc j-std-020 specification for small body components.
si7005 36 rev. 1.2 12. top marking 12.1. si7005 top marking 12.2. top marking explanation location marking explanation upper left 7005 part number upper right tttt manufacturing trace code lower left (dot) pin 1 identifier lower right yyww manufacturing date code yy = year ww = week note: the top mark may not be visible if the optional protective cover is installed. if needed, the device can be identified by reading the identification register as explain ed in section ?5.1.5. device identification?. 7005 w w y y t t t t
si7005 rev. 1.2 37 13. additional reference resources ?? si7005usb dongle user?s guide ?? si7005evb-udp user's guide ?? an607: si70xx humidity sensor designer?s guide
si7005 38 rev. 1.2 d ocument c hange l ist revision 0.1 to revision 0.2 ? updated table 2, ?general specifications*,? on page 4. ? updated table 4, ?humidity sensor,? on page 7. ?? new note 1 . ? added table 6, ?thermal characteristics,? on page 9. ? updated table 7, ?absolute maximum ratings 1 , 2 ,? on page 9. ?? updated max value for ?voltage on sda or scl pin with respect to gnd? parameter. ? updated figure 2 on page 7. ? updated figure 3 on page 8. ? updated "2.1.1. steps to pe rform relative humidity measurement" on page 9. ? updated table 12, ?14-bit temperature result available in registers 1 and 2,? on page 10. ?? revised title. ? added "2.1.6. rsvd" on page 11. ? updated "2.2. i2c operation" on page 12. ? updated table 22, ?i2c read sequence for a single register,? on page 24. ? updated table 23, ?i2c read sequence for rh or temperature conversion result,? on page 24. revision 0.2 to revision 0.9 ? updated features/applications/description ? added pinout drawing to front page ? updated electrical specifications ? clarified voltage tolerance of cs , sda, and scl pins ? updated typical applic ation circuits and boms ? updated and expanded functional description ? updated host interface ? updated register descriptions ? added drawing and photo of device with cover ? updated and expanded ordering guide ? expanded additional reference resources revision 0.9 to revision 1.0 ? updated and expanded general specification ta b l e 2 ? updated and expanded general specification ta b l e 3 ? updated figure 1. ? updated figure 2. ? updated bill of materials ? added linearization coefficients table 10,11 ? updated host interface ? updated i 2 c operation ? amended connection diagram ? amended ordering guide ? expanded additional reference resources revision 1.0 to revision 1.1 ? updated figures 2 and 3. ?? clarified rh and temperature accuracy graphs. ? updated figure 7. ?? replaced with black and white version. ? updated ?4.7 soldering? to ?4.7. pcb assembly?. ? updated table 19, ?device id revision values,? on page 22. ?? corrected title. revision 1.1 to revision 1.2 ? updated table 4, ?humidity sensor,? on page 7. ?? updated typical response time. ? updated table 7, ?absolute maximum ratings 1 , 2 ,? on page 9. ?? added esd tolerance specs.
si7005 rev. 1.2 39 n otes :
si7005 40 rev. 1.2 c ontact i nformation silicon laboratories inc. 400 west cesar chavez austin, tx 78701 tel: 1+(512) 416-8500 fax: 1+(512) 416-9669 toll free: 1+(877) 444-3032 please visit the silicon labs technical support web page: https://www.silabs.com/support/pages/contacttechnicalsupport.aspx and register to submit a technical support request. patent notice silicon labs invests in research and development to help our cust omers differentiate in the market with innovative low-power, s mall size, analog- intensive mixed-signal soluti ons. silicon labs' extensive patent portfolio is a testament to our unique approach and world-clas s engineering team. silicon laboratories and silicon labs are trademarks of silicon laboratories inc. other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders. the information in this document is believed to be accurate in all respects at the time of publ ication but is subject to change without notice. silicon laboratories assumes no responsibili ty for errors and omissions, and disclaim s responsibility for any consequences resu lting from the use of information included herein. additionally, silicon laboratories assumes no responsibility for the functioning of und escribed fea- tures or parameters. silicon laboratories reserves the right to make changes without further notice. silicon laboratories makes no warran- ty, representation or guarantee regarding t he suitability of its products for any par ticular purpose, nor does silicon laborato ries assume any liability arising out of the application or use of any product or circuit, and specif ically disclaims any and all liability, in cluding without limitation consequential or incidental damages . silicon laboratories products are not designed, intended, or authorized for use in applica tions intend- ed to support or sustain life, or for any other application in which the failure of the silicon laboratories product could crea te a situation where personal injury or death may occur. should buyer purchase or us e silicon laboratories products for any such unintended or unaut horized application, buyer shall indemnify and hold silicon laboratories harmle ss against all claims and damages.
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